Hours before the Google I/O 2017 conference, Google has pushed the next Developer Preview 4 of Android Things, that brings along with new supported hardware, features, and bug fixes.
Android Things aims to enable Android Developers to quickly build smart devices, and seamlessly scale from prototype to production using a Board Support Package (BSP) provided by Google.
New features released with DP4 include:
AIY Projects, that enable Android Things to support Raspberry Pi-based Voice Kit, now provide all necessary drivers to support Google Assistant SDK on all Android Things certified development boards.
New hardware and driver support
A new Board Support Package for NXP i.MX7D, with support for higher performance than i.MX6UL while still using a low power System on Module (SoM) design is added, too.
Support for Inter-IC Sound Bus (I2S) in Peripheral I/O API, enable audio drivers to be written in user space for sound hardware connected via an I2S bus. The AIY Voice Kit sample demonstrates how to use I2S support for audio. Also, developers can now enable/disable Bluetooth profiles at run time.
Production hardware sample
Android Things is very focused on helping developers build production-ready devices that they can bring to market. This means building custom hardware, in addition to the software running on the Android Things system-on-module (SoM). As a part of this effort,
Google has also with DP4 released “Edison Candle” production samples showcasing hardware and software designed to work together.
Code for the Edison Candle is hosted on GitHub, while hardware design files are on CircuitHub, and can be easily fabricated by many 3rd party companies.
For more details on changes, check out the Android Things release notes here.
Those interested can download images for DP4 here.