Intel "Calpella" next-gen Centrino timed with Windows 7 release

Intel is releasing its sixth generation of popular mobile platform known as Centrino, codenamed "Calpella". Intel declined to comment, but a source familiar with the plans confirmed that Intel’ll have Calpella-based products in stores for Windows 7's launch on Oct. 22. Calpella’s believed to come in multiple forms, for regular and ultra-low voltage (ULV) laptops. The ULV designs’ll use […]

Intel is releasing its sixth generation of popular mobile platform known as Centrino, codenamed "Calpella". Intel declined to comment, but a source familiar with the plans confirmed that Intel’ll have Calpella-based products in stores for Windows 7's launch on Oct. 22. Calpella’s believed to come in multiple forms, for regular and ultra-low voltage (ULV) laptops. The ULV designs’ll use 32 nanometer design, which Intel’s currently ramping up now. The first Calpella’ll use the current 45nm design. Because they’re based on the Nehalem architecture, Capella’ll abandon the northbridge and southbridge chipset arrangement used in older products. Features like the memory controller’ll be integrated onto the CPU, and Intel’ll add support for the lower-voltage DDR3 memory, reports.

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