The Wall Street Journal is reported that sources have told the paper that the next generation iPhone due this fall--and that the orders have been placed for "key components." No specifics were given on a launch date, only saying it was expected during the third quarter.
According to some suppliers of components to Apple, the new version of the iPhone is expected to be thinner and lighter than the iPhone 4, with an 8-megapixel camera. One person said the new iPhone will operate on Qualcomm Inc.'s wireless baseband chips.
It is also said to be "complicated and difficult to assemble," meaning any troubles in the manufacturing process could mean a delayed launch. Not specified is whether or not the new phone would ship with LTE support, or whether or not the device would support both CDMA and GSM networks, which some rumors have suggested it would.
The current iPhone 4 uses memory chips made by Samsung Electronics Co. and baseband chips from German chip maker Infineon Technologies AG, according to a report by market-research firm iSuppli Corp.
Neither Apple nor Hon Hai, Apple's Chinese manufacturing partner said to be building the device, would comment on the WSJ report.
Foxconn's CEO Terry Gou said:
"The touch-screen devices are so thin. It's really difficult to install so many components into the iPhones and iPads.We hope to raise the yield rate and volume in the second half which will help improve our gross margin."